LED Heat radiating substrate for high power LED

摘要

The present invention relates to a heat radiating substrate for a high power LED, capable of minimizing the phenomenon of delamination between metal layers and improving thermal conductivity. The heat radiating substrate includes: a first metal layer formed of metal selected from molybdenum, a molybdenum-copper alloy, tungsten, and a tungsten-copper alloy; a second metal layer having one surface formed on both surfaces of the first metal layer and formed of metal selected from copper, a copper alloy, aluminum, and an aluminum alloy; a third metal layer having one surface formed on the other surface of the second metal layer and formed of metal selected from nickel, a nickel alloy, cobalt, a cobalt alloy, zinc, a zinc alloy, tin and a tin alloy; and a fourth metal layer having one surface formed on the other surface of the third metal layer and formed of metal selected from gold, a gold alloy, silver, a silver alloy, and platinum alloy.