PRETREATMENT METHOD FOR COPPER-PLATING OF FPCB VIA HOLE

摘要

The present invention relates to a pretreatment method for copper-plating of a FPCB via hole. The pretreatment method comprises: a hole forming step of punching a through hole for forming a via hole in a copper clad laminate composed of a polyimide film and a copper film; a pre-etching step including an etching solution spraying process of applying an etchant to the copper clad laminate having the through hole to wet both surfaces of the copper clad laminate, and a first etching solution dipping step of passing the copper clad laminate through a dipping bath containing the etchant; a carbon lapping step of forming a carbon nanoparticle layer on both surfaces of the copper clad laminate and the through hole after the pre-etching step; a micro-etching step including an etchant solution spraying process of spraying the etchant only on a surface of the copper clad laminate after the completion of the carbon lapping step to physically remove the carbon nanoparticle layer formed on both surfaces of the copper clad laminate; and an inspection step of inspecting a state of the carbon nanoparticle layer in the through hole after the completion of the micro-etching step. According to the pretreatment method for copper-plating of a FPCB via hole of the present invention as described above, carbon nanoparticles promoting copper-plating are laminated in advance on the inner circumferential surface of the via hole to form a copper-plating layer with a uniform thickness in the via hole when processing plating, thereby improving the electrical reliability of an FPCB.;COPYRIGHT KIPO 2019