Manufacturing Method of Transfer Printed Circuit Board Using Temporary Bonding and De-bonding Adhesives

摘要

According to the present invention, a transfer circuit board can reduce the thickness of a multi-layered transfer circuit board and improve bending for a soft printed board by forming a conductive pattern layer on a temporary bonding adhesive material with conductive paste or conductive ink, temporarily fixing an electronic device on the conductive pattern, forming a soft board or a hard board in which the electronic device and the conductive pattern are embedded thereafter, and stacking an external protection layer after separating from the temporarily fixed adhesive material. In addition, RLC characteristics of a board are improved by reducing a distance between the electronic device and a wire pattern. Furthermore, by directly printing the conductive paste or the conductive ink to stack, the reliability of a bonding unit can be improved, an interlayer alignment state in a multi-layered board can be maintained at a high level, and a process can be simplified without requiring an additional process related to a via hole.