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IISnS Method for manufacturing of tin sulfide IISnS thin film

机译:IISnS方法制造硫化锡IISnS薄膜

摘要

The present invention relates to a method to form a thin film of tin sulfide (II) (SnS), capable of providing a high-quality tin sulfide (II) thin film without an impurity formed on a substrate. According to the present invention, the method to form a thin film of tin sulfide (II) is a method to form a tin sulfide (II) thin film on a substrate in a chemical vapor deposition method using a tin precursor and a sulfide precursor. The tin precursor is an organometallic compound which has an oxidation value of tin is +2, and the temperature of the substrate to form the tin sulfide (II) thin film is within a range of 90 to 300°C.
机译:形成硫化锡(II)(SnS)薄膜的方法技术领域本发明涉及一种形成硫化锡(II)(SnS)薄膜的方法,该方法能够提供高质量的硫化锡(II)薄膜,而不会在基板上形成杂质。根据本发明,形成硫化锡(II)的薄膜的方法是在使用锡前驱体和硫化物前驱体的化学气相沉积法中在基板上形成硫化锡(II)薄膜的方法。锡前体是锡的氧化值为+2的有机金属化合物,形成硫化锡(II)薄膜的基板的温度在90〜300℃的范围内。

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