Wet etching and laser-assisted metal foil hole machining method

摘要

The present invention provides a metal foil hole processing method using a wet etching and a laser which forms a dimple by using a wet etching and forms a hole on the dimple by a laser. An undercut phenomenon is remarkably reduced as compared with an existing thing to be easy to control to a desired hole size so as to remarkably shorten a hole processing time, thereby shortening a progressing time. Moreover, the present invention can reduce the undercut phenomenon during processing the hole in a large area as well as reduce a total processing time.