Wet etching and laser-assisted metal foil hole machining method

摘要

In the present invention, a dimple is formed using wet etching, and then a laser-formed hole is formed in the dimple. As a result, the undercut phenomenon is remarkably reduced compared with the prior art, so that it is easy to control to a desired hole size, The present invention provides a method of wet etching a metal sheet using a laser and a wet etching method capable of reducing an undercut in a large area hole processing and reducing a total processing time.