Differential via structure circuit substrate having the same and method of manufacturing the substrate

摘要

A differential via structure, a circuit board having the same, and a manufacturing method thereof are disclosed. The differential via structure comprises: a flat plate via having a pair of first and second flat plates passing through an insulator while being separated by a first separation distance to face each other; a connection pad having a first contact accessing the first flat plate and a second contact accessing the second flat plate and separated from the first contact; and an access line having first and second connection lines extended for each contact. The access line interconnects a differential signal line composed of a transmission signal line and a complementary signal line. A characteristic impedance variation between the differential signal line and the differential via structure can be minimized.