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Methods of measuring substrate properties, inspection apparatus, lithography systems, and device manufacturing methods

机译:测量基板特性的方法,检查设备,光刻系统和器件制造方法

摘要

A method of measuring a property of a substrate, the substrate comprising a plurality of targets formed on the substrate, the method comprising measuring N of the plurality of targets using an optical measurement system, wherein N is greater than 2 A large integer and each of the N targets is measured Wt times and Wt is an integer greater than 2 to obtain N * Wt measurements; And determining R attribute values using Q equations and N * Wt measurements, wherein R Q ≦ N * Wt, and the optical measurement system has at least one changeable setting, For each of the N targets, a measurement value is obtained using different setting values of at least one changeable setting.
机译:一种测量衬底的性能的方法,该衬底包括在衬底上形成的多个目标,该方法包括使用光学测量系统测量多个目标中的N个,其中N大于2 A大整数,并且每个测量N个目标的Wt时间,并且Wt是大于2的整数以获得N * Wt测量;并使用Q方程和N * Wt测量确定R属性值,其中R

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