Cd free 18K Cd free solder material for 18 K red gold

摘要

Provided is a Cd free 18K red gold solder material. The present invention relates to a solder material of an 18K red gold master alloy composed of Au-Cu-Ag ternary system, wherein the Cd free 18K red gold solder material comprises 15-22 wt% of Cu, 3-10 wt% of In, and the remaining consisting of Au. Therefore, the present invention is capable of sufficiently securing a content of gold so as not to cause a decrease in content of a final product.