首页> 外国专利> SUBSTRATE ALIGNMENT APPARATUS SUBSTRATE PROCESSING APPARATUS SUBSTRATE ARRANGEMENT APPARATUS SUBSTRATE ALIGNMENT METHOD SUBSTRATE PROCESSING METHOD AND SUBSTRATE ARRANGEMENT METHOD

SUBSTRATE ALIGNMENT APPARATUS SUBSTRATE PROCESSING APPARATUS SUBSTRATE ARRANGEMENT APPARATUS SUBSTRATE ALIGNMENT METHOD SUBSTRATE PROCESSING METHOD AND SUBSTRATE ARRANGEMENT METHOD

机译:基板对位装置基板对位装置基板对位装置基板对位方法基板对位方法及基板对位方法

摘要

The motor of the substrate aligning device successively rotates the plurality of substrates to be held by the substrate holding portion in the vertical posture in the circumferential direction. The control unit controls the motor based on the input information and bending-notch position information inputted for the bending states of the plurality of substrates, and determines the position of the notches in the circumferential direction of the plurality of substrates. This reduces the distance in the thickness direction between the lower edge portion and the upper end of each substrate in the state held by the substrate holding portion. As a result, handling of the plurality of substrates held by the substrate holding portion can be facilitated.
机译:基板对准装置的电动机沿周向以竖直姿势连续旋转要被基板保持部保持的多个基板。控制单元基于针对多个基板的弯曲状态输入的输入信息和弯曲切口位置信息来控制电动机,并且确定切口在多个基板的圆周方向上的位置。这减小了在由基板保持部保持的状态下每个基板的下边缘部和上端之间在厚度方向上的距离。结果,可以容易地处理由基板保持部保持的多个基板。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号