首页> 外国专利> THERMOPLASTIC RESIN COMPOSITION FOR LASER DIRECT STRUCTURING PROCESS AND COMPOSITE COMPRISING THE SAME

THERMOPLASTIC RESIN COMPOSITION FOR LASER DIRECT STRUCTURING PROCESS AND COMPOSITE COMPRISING THE SAME

机译:激光直接成型过程的热塑树脂组合物及其组成

摘要

The thermoplastic resin composition for a laser direct structuring process of the present invention comprises (A) 60 to 75 wt% of a polycarbonate resin; (B) 5 to 30% by weight of an aromatic vinyl-diene-vinyl cyanide copolymer having a structure of a continuous phase and a dispersed phase; (C) 1 to 15% by weight of the rubber-modified aromatic vinyl graft copolymer having a core-shell structure; (D) 1 to 10% by weight of an additive for laser direct structuring, characterized in that the R W value defined by Equation 1 is greater than 1 and less than 6: [Equation 1] R W = W B / W C (In Formula 1, W B is the weight of the aromatic vinyl-diene-vinyl cyanide copolymer having the structure of (B) continuous phase and dispersed phase, W C is a rubber-modified aromatic vinyl graft copolymer having a core-shell structure) Weight)
机译:本发明的用于激光直接成型工艺的热塑性树脂组合物包含:(A)60至75重量%的聚碳酸酯树脂;和(B)5-30重量%的具有连续相和分散相结构的芳族乙烯基-二烯-乙烯基氰共聚物; (C)1-15重量%的具有核-壳结构的橡胶改性的芳族乙烯基接枝共聚物; (D)1至10重量%的用于激光直接结构化的添加剂,其特征在于,方程1定义的R W 值大于1 小于6 :[公式1] R W = W B / W C (在公式1中,W B 是具有(B)连续相和分散相结构的芳族乙烯基-二烯-乙烯基氰化物共聚物的重量,W C 是具有核-壳结构的橡胶改性芳族乙烯基接枝共聚物) )

著录项

  • 公开/公告号KR102013020B1

    专利类型

  • 公开/公告日2019-08-21

    原文格式PDF

  • 申请/专利权人 롯데첨단소재(주);

    申请/专利号KR20160184492

  • 申请日2016-12-30

  • 分类号C08L69;B41M5/26;C08J7/12;C08K3/10;C08K3/22;C08L47;C08L51/04;C23C18/16;C23C18/20;H05K1/03;H05K3/18;

  • 国家 KR

  • 入库时间 2022-08-21 11:47:55

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