首页>
外国专利>
THERMOPLASTIC RESIN COMPOSITION FOR LASER DIRECT STRUCTURING PROCESS AND COMPOSITE COMPRISING THE SAME
THERMOPLASTIC RESIN COMPOSITION FOR LASER DIRECT STRUCTURING PROCESS AND COMPOSITE COMPRISING THE SAME
展开▼
机译:激光直接成型过程的热塑树脂组合物及其组成
展开▼
页面导航
摘要
著录项
相似文献
摘要
The thermoplastic resin composition for a laser direct structuring process of the present invention comprises (A) 60 to 75 wt% of a polycarbonate resin; (B) 5 to 30% by weight of an aromatic vinyl-diene-vinyl cyanide copolymer having a structure of a continuous phase and a dispersed phase; (C) 1 to 15% by weight of the rubber-modified aromatic vinyl graft copolymer having a core-shell structure; (D) 1 to 10% by weight of an additive for laser direct structuring, characterized in that the R W value defined by Equation 1 is greater than 1 and less than 6: [Equation 1] R W = W B / W C (In Formula 1, W B is the weight of the aromatic vinyl-diene-vinyl cyanide copolymer having the structure of (B) continuous phase and dispersed phase, W C is a rubber-modified aromatic vinyl graft copolymer having a core-shell structure) Weight)
展开▼
机译:本发明的用于激光直接成型工艺的热塑性树脂组合物包含:(A)60至75重量%的聚碳酸酯树脂;和(B)5-30重量%的具有连续相和分散相结构的芳族乙烯基-二烯-乙烯基氰共聚物; (C)1-15重量%的具有核-壳结构的橡胶改性的芳族乙烯基接枝共聚物; (D)1至10重量%的用于激光直接结构化的添加剂,其特征在于,方程1定义的R W Sub>值大于1 , Sub>小于6 :[公式1] R W Sub> = W B Sub> / W C Sub>(在公式1中,W B Sub>是具有(B)连续相和分散相结构的芳族乙烯基-二烯-乙烯基氰化物共聚物的重量,W C Sub>是具有核-壳结构的橡胶改性芳族乙烯基接枝共聚物) )
展开▼