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A method of depositing a C-doped AlN layer on a silicon substrate and a semiconductor device constructed of such a layer structure

机译:在硅基板上沉积C掺杂的AlN层的方法以及由这种层结构构成的半导体器件

摘要

The invention relates to a method for depositing a layer (2) of elements of the III-V main group on a silicon substrate (1), wherein the substrate (1) is heated in a process chamber (10) of a CVD reactor to a process temperature and gaseous III- or V-starting materials (13, 14), which contain the elements of the III and V main group are introduced into the process chamber (10) are chemically decomposed there and the decomposition products directly on the substrate surface a III-V layer form. In order to compensate for an n-doping due to a diffusion of silicon into the layer, a carbon-containing gaseous starting material (15) is additionally introduced into the process chamber (10). A semiconductor device produced by this method has a nucleation layer (2) applied directly to the substrate (1) doped with both silicon and carbon.
机译:本发明涉及在硅衬底(1)上沉积III-V族主族元素的层(2)的方法,其中衬底(1)在CVD反应器的处理室(10)中被加热至将处理温度和包含III和V主族元素的气态III或V起始材料(13、14)引入到处理室(10)中,在那里进行化学分解,分解产物直接在基板上表面形成III-V层形式。为了补偿由于硅扩散到该层中引起的n掺杂,将含碳的气态起始材料(15)另外引入到处理室(10)中。通过这种方法生产的半导体器件具有直接施加到同时掺杂有硅和碳的衬底(1)上的成核层(2)。

著录项

  • 公开/公告号DE102017120896A1

    专利类型

  • 公开/公告日2019-03-14

    原文格式PDF

  • 申请/专利权人 AIXTRON SE;

    申请/专利号DE201710120896

  • 发明设计人 CHRISTOF MARTIN MAUDER;

    申请日2017-09-11

  • 分类号C23C16/455;

  • 国家 DE

  • 入库时间 2022-08-21 11:45:23

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