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Dosing device and method for providing a defined amount of a solder material
Dosing device and method for providing a defined amount of a solder material
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机译:用于提供限定量的焊料的定量给料装置和方法
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摘要
The present invention relates to a metering device (200) and a method for providing a defined amount of a solder material (450), the metering device (200) comprising: (a) a metering tip (210) having a first opening (220) for metered delivery of the Soldering material (450); and (b) a controlled local heat source (280) for locally reducing the viscosity of the solder material (450) in the dosing tip (210) so that a defined amount of the solder material (450) moves from the first opening (220) to a first one due to gravity to be soldered area (130) can fall down.
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