Soldering method for connecting metal parts with dosable solder material involves applying solder material to solder point(s); material is fed to solder point with adjustable quantitative dosing

摘要

The method involves applying solder material (2) to at least one solder point, whereby the solder material is fed to the solder point with adjustable quantitative dosing. The solder material is held in a heatable container (1). The solder material is fed to the solder point by a pump element (3) in the form of a piston pump. The solder material can be fed via a quantitatively dosable valve element (4). An independent claim is also included for the following: (a) a soldering arrangement for implementing the inventive method.