首页> 外国专利> METHOD FOR MANUFACTURING A HETEROSTRUCTURE COMPRISING PHOTONIC ELEMENTARY STRUCTURES IN III-V MATERIAL ON THE SURFACE OF A SILICON-BASED SUBSTRATE

METHOD FOR MANUFACTURING A HETEROSTRUCTURE COMPRISING PHOTONIC ELEMENTARY STRUCTURES IN III-V MATERIAL ON THE SURFACE OF A SILICON-BASED SUBSTRATE

机译:在硅基基质表面上制造包含III-V材料光子基本结构的异质结构的方法

摘要

A process for fabricating a heterostructure includes at least one elementary structure made of III-V material on the surface of a silicon-based substrate successively comprising: producing a first pattern having at least a first opening in a dielectric material on the surface of a first silicon-based substrate; a first operation for epitaxy of at least one III-V material so as to define at least one elementary base layer made of III-V material in the at least first opening; producing a second pattern in a dielectric material so as to define at least a second opening having an overlap with the elementary base layer; a second operation for epitaxy of at least one III-V material on the surface of at least the elementary base layer made of III-V material(s) so as to produce the at least elementary structure made of III-V material(s) having an outer face; an operation for transferring and assembling the at least photonic active elementary structure via its outer face, on an interface that may comprise passive elements and/or active elements, the interface being produced on the surface of a second silicon-based substrate; removing the first silicon-based substrate and the at least elementary base layer located on the elementary structure.
机译:一种制造异质结构的方法,该方法包括在硅基衬底的表面上至少包括由III-V材料制成的基本结构,该基本结构依次包括:在第一衬底的表面上的介电材料中产生具有至少第一开口的第一图案。硅基基板;用于至少一种III-V材料的外延的第一操作,以便在至少第一开口中限定由III-V材料制成的至少一个基本基底层;在介电材料中产生第二图案,以限定至少第二开口,该第二开口与基本基底层重叠。在至少由III-V材料制成的基本基础层的表面上对至少一种III-V材料进行外延的第二操作,以产生由III-V材料制成的至少基本结构有外面的通过至少一个光子有源基本结构的外表面在可能包括无源元件和/或有源元件的界面上转移和组装至少一个光子有源基本结构的操作,该接口在第二硅基衬底的表面上产生;去除第一硅基衬底和位于基本结构上的至少基本基层。

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