MULTI-LAYER STRUCTURE, PACKAGING MATERIAL AND PRODUCT THAT USE SAME, AND PROTECTIVE SHEET FOR ELECTRONIC DEVICES

摘要

The present invention relates to a multilayer structure including a base (X) and a layer (Y) stacked on the base (X). The layer (Y) contains an aluminum-containing compound (A), an organic phosphorus compound (BO), and a polymer (F) having an ether bond and having no glycosidic bond.