COMPOSITION FOR SINTER BONDING, SHEET FOR SINTER BONDING, AND DICING TAPE HAVING SHEET FOR SINTER BONDING

摘要

The sinter-bonding composition according to the present invention contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 µm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) according to the present invention has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) according to the present invention has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20). The sinter-bonding composition, the sinter-bonding sheet and the dicing tape with a sinter-bonding sheet according to the present invention are suitable for materializing sinter-bonding by a high-density sintered layer under a low-loading condition.