首页> 外国专利> METHOD FOR MANUFACTURING AN OPTOELECTRONIC INFRARED EMITTING DEVICE COMPRISING AN ACTIVE LAYER BASED ON GERMANIUM-TIN

METHOD FOR MANUFACTURING AN OPTOELECTRONIC INFRARED EMITTING DEVICE COMPRISING AN ACTIVE LAYER BASED ON GERMANIUM-TIN

机译:基于锗锡的包含有源层的光电红外发射器件的制造方法

摘要

The invention relates to a method for manufacturing an optoelectronic device (1) for emitting infrared radiation (lambda2), comprising the following steps: i) making a first stack (10) comprising: o a source luminous (11) excitation, o a first bonding sublayer (17) made of a metallic material chosen from gold, titanium and copper, ii) production of a second stack (20) comprising: o an active layer (23) based on infrared re-emitting GeSn (lambda2), obtained by epitaxy at an epitaxy temperature (T sub epi /sub), o a second bonding sublayer (25) made of said metallic material, iii) determination of an assembly temperature (Tc) between an ambient temperature (T sub amb /sub) and said epitaxy temperature, to within 10%, such that a surface energy of direct bonding of said metallic material is greater than or equal to 0.5 J / m sup 2 /sup; iv) enough mblage by direct bonding, at said assembly temperature, of said stacks.
机译:本发明涉及一种用于制造用于发射红外辐射(λ2)的光电子器件(1)的方法,其包括以下步骤:i)制造第一堆叠(10),该第一堆叠包括:光源发光(11)激发,第一键合子层(17)由选自金,钛和铜的金属材料制成; ii)生产第二堆叠(20),该第二堆叠包括:o基于红外重现GeSn(lambda2)的有源层(23),该有源层通过外延在外延温度(T epi ),由所述金属材料制成的第二粘结子层(25),iii)确定环境温度(T amb )和所述外延温度,在10%以内,以使所述金属材料直接键合的表面能大于或等于0.5 J / m 2 ; iv)在所述组装温度下通过直接粘结所述叠层进行足够的包装。

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