首页> 外国专利> OPTOELECTRONIC INFRARED-EMITTING DEVICE COMPRISING AN ACTIVE LAYER BASED ON GERMANIUM-TIN AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC INFRARED-EMITTING DEVICE COMPRISING AN ACTIVE LAYER BASED ON GERMANIUM-TIN AND METHOD FOR MANUFACTURING THE SAME

机译:光电红外发射装置,包括基于锗 - 锡的有源层和制造方法

摘要

The invention relates to a method for manufacturing an optoelectronic device (1) for emitting infrared radiation (lambda2), comprising the following steps: i) making a first stack (10) comprising: o a source luminous (11) excitation, o a first bonding sublayer (17) made of a metallic material chosen from gold, titanium and copper, ii) production of a second stack (20) comprising: o an active layer (23) based on infrared re-emitting GeSn (lambda2), obtained by epitaxy at an epitaxy temperature (T epi ), o a second bonding sublayer (25) made of said metallic material, iii) determination of an assembly temperature (Tc) between an ambient temperature (T amb ) and said epitaxy temperature, to within 10%, such that a surface energy of direct bonding of said metallic material is greater than or equal to 0.5 J / m 2 ; iv) enough mblage by direct bonding, at said assembly temperature, of said stacks.
机译:本发明涉及一种用于制造用于发射红外辐射(Lambda2)的光电器件(1)的方法,包括以下步骤:i)制造第一堆叠(10),包括:OA源发光(11)激励,OA第一键合子层(17)由选自金,钛和铜,II)制成的金属材料制成的第二堆叠(20),其包括:通过外延获得的红外重新发射Gesn(Lambda2)的活性层(23)。由所述金属材料制成的外延温度(T EPI ),OA第二键合子窗(25),III)在环境温度(T AMB )和所述外延温度在10%以内,使得所述金属材料的直接键合的表面能大于或等于0.5J / m 2 ; iv)通过直接粘合在所述组装温度下,在所述组装温度下,在所述组装温度下进行足够的mblage。

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