A method of removing liquid from the top surface of the wafer to be polished, and an elastic film for pressing the wafer against the polishing pad.

摘要

PROBLEM TO BE SOLVED: To provide a method for removing a liquid from an upper surface of a wafer to be polished and enabling a polishing head to apply an appropriate force to the wafer. A method of polishing a wafer W by using a polishing head 1 having a central pressure chamber and an outer pressure chamber formed by an elastic film 34, wherein the central portion of the elastic film 34 is the center of the upper surface of the wafer W. The liquid Q is removed from the upper surface of the wafer W by contacting the outer peripheral portion of the elastic film 34 with the outer peripheral portion of the upper surface of the wafer W, and the lower surface of the wafer W is made into a polished surface by the elastic film 34. It is pressed to polish the lower surface of the wafer W. [Selection diagram] Fig. 5