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Method for producing metallic copper / copper oxide-containing powder, metallic copper / copper oxide-containing powder, and method for producing sputtering target material and sputtering target material.
Method for producing metallic copper / copper oxide-containing powder, metallic copper / copper oxide-containing powder, and method for producing sputtering target material and sputtering target material.
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机译:金属铜/含铜氧化物粉末的制造方法,金属铜/含铜氧化物粉末以及溅射靶材和溅射靶材的制造方法。
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摘要
PROBLEM TO BE SOLVED: To sufficiently improve the filling rate in a container, a metallic copper / copper oxide-containing powder particularly suitable as a sintering raw material, a method for producing the metallic copper / copper oxide-containing powder, and stable. Provided are a sputtering target capable of forming a copper oxide film, and a method for manufacturing the sputtering target. SOLUTION: The metal copper / copper oxide-containing powder 10 is composed of a metal copper powder 11, a copper oxide powder 12, and unavoidable impurities, and the metal copper powder 11 has a larger average particle size than the copper oxide powder 12. The composite particles 15 have a structure in which the copper oxide powder 12 is attached to the outer peripheral portion of the metal copper powder 11. Further, a recess is formed in the outer peripheral portion of the metal copper powder 11, and the composite particle 15 has a structure in which the recess formed in the outer peripheral portion of the metal copper powder 11 is filled with the copper oxide powder 12. You may. [Selection diagram] Fig. 1
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