Manufacturing method of integrated circuit board, sensing device, biometric information analysis device and integrated circuit board

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit board, a sensing device, a biological information analysis device and a method for manufacturing an integrated circuit board which suppress damage to a wiring portion due to bending. A flexible film substrate (4), a plurality of electronic components (5) arranged above the film substrate (4) and including integrated circuits (5b) and (5c), and a film substrate (4) and a plurality of electronic components (5). It is provided with wiring portions 6a to 6e that are arranged and electrically connect a plurality of electronic components 5, and the wiring portions 6a to 6e are laminated with conductive telescopic conductive portions 7a to 7e and low resistance conductive portions 8a to 8e. The stretchable conductive portions 7a to 7e are arranged so as to extend toward the film substrate 4, and have higher elasticity than the low resistance conductive portions 8a to 8e and the film substrate 4, and the low resistance conductive portions 8a. ~ 8e have a lower resistance than the telescopic conductive portions 7a to 7e, and are laminated on the upper side of the telescopic conductive portions 7a to 7e and connected to a plurality of electronic components 5. [Selection diagram] Fig. 2