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Semiconductor manufacturing equipment and display manufacturing equipment including semiconductor manufacturing equipment members and semiconductor manufacturing equipment members

机译:半导体制造设备和显示器制造设备,包括半导体制造设备构件和半导体制造设备构件

摘要

PROBLEM TO BE SOLVED: To provide a member for a semiconductor manufacturing apparatus capable of reducing particles. SOLUTION: A base material including a first surface, a second surface intersecting the first surface, and a ridge portion connecting the first surface and the second surface, and the first surface, said. A particle-resistant layer that covers the second surface and the ridge portion and contains polycrystalline ceramics, the first particle-resistant layer provided on the ridge portion and the second particle-resistant layer provided on the first surface. Provided is a member for a semiconductor manufacturing apparatus comprising a particle-resistant layer including and, wherein the particle resistance of the first particle-resistant layer is higher than the particle resistance of the second particle-resistant layer. [Selection diagram] Fig. 2
机译:要解决的问题:提供一种用于能够减少颗粒的半导体制造设备的构件。解决方案:一种基础材料,包括第一表面,与第一表面相交的第二表面以及连接第一表面和第二表面以及第一表面的脊部。覆盖第二表面和脊部并包含多晶陶瓷的抗颗粒层,设置在脊部上的第一抗颗粒层和设置在第一表面上的第二抗颗粒层。提供一种用于半导体制造设备的构件,该构件包括具有和的防颗粒层,其中,第一防颗粒层的颗粒电阻高于第二防颗粒层的颗粒电阻。 [选择图]图2

著录项

  • 公开/公告号JP2020141128A

    专利类型

  • 公开/公告日2020-09-03

    原文格式PDF

  • 申请/专利权人 TOTO株式会社;

    申请/专利号JP20190238045

  • 发明设计人 新田 安隆;和田 琢真;滝沢 亮人;

    申请日2019-12-27

  • 分类号H01L21/3065;H01L21/673;H01L21/683;H01L21/31;C23C16/44;

  • 国家 JP

  • 入库时间 2022-08-21 11:37:02

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