SUBSTRATE FOR ELECTRO-OPTIC DEVICE, INDIVIDUAL SUBSTRATE, ELECTRO-OPTIC DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING SUBSTRATE FOR ELECTRO-OPTIC DEVICE

摘要

To provide a substrate for an electro-optic device which hardly causes dielectric breakdown in an inner circuit or connection wiring of an individual substrate by static electricity induced upon cutting.SOLUTION: A chip C11 as an individual substrate includes an inner circuit and a terminal 104 for external connection as a first connection terminal disposed on one side line of the chip C11, in which the terminal 104 for external connection has one end side electrically connected to a guard line 109a as first common wiring extending along the first side line via a first electrostatic protection circuit PE1, and the other end side electrically connected to the inner circuit via connection wiring 830 as first connection wiring. The inner circuit side of the connection wiring 830 is electrically connected via a second electrostatic protection circuit PE2 to a guard line 109b as second common wiring extending along a second side line intersecting with he first side line.SELECTED DRAWING: Figure 7