THERMAL STRESS ANALYSIS PROGRAM, THERMAL STRESS ANALYSIS METHOD, AND INFORMATION PROCESSING APPARATUS

摘要

To improve accuracy of analyzing warpage of a substrate.SOLUTION: An information processing apparatus 100 stores a measurement value indicating physical property of thermosetting resin in a temperature range during thermal curing in a storage unit 101. The thermosetting resin is included in a prepreg material 113, for example. The information processing apparatus 100 acquires design data of a substrate 110. The information processing apparatus 100 acquires profile data for the temperature range during thermal curing. The information processing apparatus 100 executes thermal stress analysis on the substrate 110 in the temperature range during thermal curing, by use of the measurement value indicating physical property of thermosetting resin in the temperature range during thermal curing, on the basis of the acquired design data and the acquired profile data.SELECTED DRAWING: Figure 1