CONDUCTIVE PASTE FOR LASER ETCHING PROCESSING, CONDUCTIVE THIN FILM AND CONDUCTIVE LAMINATE

摘要

To provide a laser etching processing conductive paste suitable for laser etching processing, capable of manufacturing, with a low cost and a low environmental load, high-density electrode circuit wiring having L/S of 50/50 μm or less that is difficult to be achieved by the conventional screen printing method.SOLUTION: A conductive paste for laser etching processing contains a binder resin (A) formed of one or two or more mixtures selected from the group consisting of a polyurethane resin, a phenoxy resin, a vinyl chloride resin and a cellulose derivative resin, metal powder (B) and an organic solvent (C), where the binder resin (A) is a thermoplastic resin having a number average molecular weight of 5,000-60,000 and a glass transition temperature of 60-100°C, and is used for forming an electrode circuit wiring having widths of a line and a space in a plane direction of 50 μm or less on the transparent conductive layer of a base material having a transparent conductive layer on the whole or a part thereof, and an electrode circuit wiring having a line width in the plane direction of 25-31 μm and a space width in the plane direction of 28-32 μm can be formed by the laser etching process using a laser beam with a beam diameter of 30 μm.SELECTED DRAWING: None