A method for manufacturing a photosensitive resin composition, a cured film obtained by curing the photosensitive resin composition, a substrate with a cured film, and a substrate with a cured film.

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a resin film pattern having excellent development adhesion and linearity and excellent solvent resistance, alkali resistance and the like even when a substrate having low heat resistance is used. To do. The photosensitive resin composition of the present invention is a photosensitive resin composition used for forming a cured film on a substrate having a heat resistant temperature of 140 ° C. or lower, and is (A) an unsaturated group-containing epoxy. A soluble resin, (B) a photopolymerizable monomer having at least two or more ethylenically unsaturated bonds, (C) an epoxy compound having two or more epoxycyclohexyl groups, and (D) initiation of photopolymerization. It contains an agent and (E) solvent. The content of the component (C) is 5 to 17% by mass with respect to the total mass of the solid content. [Selection diagram] None