IN-LINE DPS CHAMBER HARDWARE DESIGN ENABLING AXIAL SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY

摘要

To provide an apparatus and method for symmetry of electric field, gas flow, and heat distribution within a processing chamber to achieve processing uniformity.SOLUTION: A plasma processing chamber 100 includes a plasma source 110, a substrate support assembly 130, and a vacuum pump 180 located along the same central axis. The substrate support assembly 130 includes an electrostatic chuck 132 for supporting and securing the substrate 101 during processing. The electrostatic chuck 132 is formed of a dielectric material having an electrode and/or heater embedded therein and is disposed on a facility plate 134. The facility plate 134 includes features that can provide electrical connection, gas supply, and temperature control to the electrostatic chuck 132. The electrostatic chuck 132 and the facility plate 134 can be overlaid on a support block 136.SELECTED DRAWING: Figure 1B