Erratum: “The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique” [AIP Advances 3(7), 072117 (2013)]

M.-H. Liao; C.-H. Chen

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Erratum: “The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique” [AIP Advances 3(7), 072117 (2013)]

机译：勘误表：“随着3D全室建模和实验视觉技术的发展，新颖的腔室硬件设计可提高12英寸（300毫米）和18英寸（450毫米）晶片的薄膜沉积质量” [AIP进展3（7 ），072117（2013）]

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《AIP Advances》 |2015年第4期|共页
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M.-H. Liao; C.-H. Chen;
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1. The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique [J] . M.-H. Liao, C.-H. Chen AIP Advances . 2013,第7期

机译：新颖的腔室硬件设计，通过3D全腔室建模和实验视觉技术的开发，可提高12英寸（300毫米）和18英寸（450毫米）晶圆的薄膜沉积质量
2. The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique [J] . M.-H. Liao, C.-H. Chen, S.-C. Kao International Journal of Heat and Mass Transfer . 2013,第deca期

机译：新颖的腔室硬件设计，通过3D全腔室建模和实验视觉技术的开发，可提高12英寸（300毫米）和18英寸（450毫米）晶圆的薄膜沉积质量
3. The chemical vapor deposition chamber design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D chamber modeling and experimental visual technique [C] . Ming.-Han.Liao, Chih.-Hua.Chen, Ssu.-Chieh.Kao, E-Manufacturing Design Collaboration Symposium . 2013

机译：化学气相沉积室设计可通过3D室建模和实验视觉技术的开发来提高12英寸（300毫米）和18英寸（450毫米）晶圆的薄膜沉积质量
4. Erratum: “The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique” [AIP Advances 3(7), 072117 (2013)] [O] . M.-H. Liao, C.-H. Chen 2015

机译：Erratum：“新型腔室硬件设计，通过3D全腔造型和实验视觉技术的发展，改善12”（300 mm）和18“（450 mm）晶圆的薄膜沉积质量”[aIp advances 3（7 ），072117（2013）]

Erratum: “The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique” [AIP Advances 3(7), 072117 (2013)]

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