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ULTRA-HIGH-SPEED INSPECTION DEVICE USING ELECTRON AND ULTRA-HIGH-SPEED INSPECTION METHOD USING ELECTRON

机译:电子超高速检测装置及电子超高速检测方法

摘要

To provide an ultra-high-speed inspection device using electrons and an ultra-high-speed inspection method using electrons such that the ultra-high-speed inspection device acquires electron distribution information on which a three-dimensional structure of a sample surface is reflected to inspect a pattern defect at a high speed.SOLUTION: An ultra-high-speed inspection device using electrons comprises: one or more electron detection devices 3 which detect three-dimensional angle distribution information, three-dimensional intensity distribution information, or three-dimensional energy distribution information on electrons emitted to a three-dimensional space or electrons reflected depending upon a three-dimensional structure of an object of measurement in a predetermined region when the predetermined region is irradiated with electrons; collation means which collates one or more of the three-dimensional angle distribution information, three-dimensional intensity distribution information, or three-dimensional energy distribution information on the electrons detected by the electron detection device 3 with three-dimensional reference information generated through simulation of a predetermined region of a sample; and means 29 which outputs a result of the collation by the collation means.SELECTED DRAWING: Figure 1
机译:提供一种使用电子的超高速检查装置和使用电子的超高速检查方法,使得该超高速检查装置获取电子分布信息,在该电子分布信息上反映了样品表面的三维结构。解决方案:一种使用电子的超高速检查设备,包括:一个或多个电子检测设备3,用于检测三维角度分布信息,三维强度分布信息或三维检测信息。当向预定区域照射电子时,关于在预定区域中发射到三维空间的电子或取决于测量对象的三维结构而反射的电子的三维能量分布信息;核对装置,对电子检测装置3所检测出的电子的三维角分布信息,三维强度分布信息或三维能量分布信息中的一者或多者与通过模拟电子产生的三维参考信息进行对照。样品的预定区域;装置29输出由该核对装置输出的核对结果。图1

著录项

  • 公开/公告号JP2020020808A

    专利类型

  • 公开/公告日2020-02-06

    原文格式PDF

  • 申请/专利权人 HORON:KK;

    申请/专利号JP20190188495

  • 发明设计人 YAMADA KEIZO;

    申请日2019-10-15

  • 分类号G01N23/2251;

  • 国家 JP

  • 入库时间 2022-08-21 11:34:58

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