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Micro light emitting diode transfer method, manufacturing method, micro light emitting diode device, and electronic device

机译:微发光二极管的转移方法,制造方法,微发光二极管装置以及电子设备

摘要

The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate, wherein the micro-LEDs are lateral micro-LEDs whose P electrodes and N electrodes are located on one side; bringing the P electrodes and N electrodes of the lateral micro-LEDs into contact with pads preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the lateral micro-LEDs from the original substrate. A technical effect of using lateral micro-LEDs lies in that the processing for N metal electrode after the micro-LED transfer can be omitted.
机译:本发明公开了一种微型LED的转移方法,制造方法,装置和电子设备。转移微型LED的方法包括:在激光透明的原始基板上形成微型LED,其中,微型LED是P电极和N电极位于一侧的横向微型LED;使横向微型LED的P电极和N电极与接收基板上预设的焊盘接触;从原基板侧照射激光,从原基板上剥离侧面的微型LED。使用横向微型LED的技术效果在于,可以省略微型LED转移之后对N金属电极的处理。

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