Integrated circuit nanoparticle thermal routing structure in the interconnect region

摘要

In the example described, an integrated circuit (100) has a substrate (102) and an interconnect region (106) disposed on the substrate (102). The interconnect region (106) has an interconnect level. The integrated circuit (100) includes a thermal routing structure (130) in an interconnect region (106). The thermal routing structure (130) extends over some, but not all, of the integrated circuit (100) at the interconnect region (106). The thermal routing structure (130) includes an aggregated nanoparticle film in which adjacent nanoparticles are aggregated together. The thermal routing structure (130) has a higher thermal conductivity than the dielectric material in contact with the thermal routing structure (130). The aggregated nanoparticle film is formed by a method including an additive process.