MEMS device, MEMS switch, and manufacturing method of MEMS switch

摘要

PROBLEM TO BE SOLVED: To provide a MEMS device with high adhesion between a transmission line and an insulator layer, a MEMS switch, and a manufacturing method of the same.SOLUTION: Between a high frequency line 21 and an insulator layer 24, a thin film adhesion layer 23, having insulating properties, made of a material having higher (high-frequency) insulating properties than the insulator layer 24, is formed. By providing the thin film adhesion layer 23 made of a material being closely in contact with both the high frequency line 21 and the insulator layer 24, it becomes possible to increase adhesion between the high frequency line 21 and the insulator layer 24 than before. As a result, a leakage route is not formed between the high frequency line 21 and the insulator layer 24.SELECTED DRAWING: Figure 1