Electronic component bonding structure and method for manufacturing electronic component bonded body

摘要

The utility model provides an electronic parts's joint structure. Electronic parts's joint structure possesses: 1 electronic parts contains: the 1st substrate (11), formed at the 1st electrode (12) of the installation face (S1) of the 1st substrate (11) with have a part of opening that exposes of making the 1st electrode (12) and formed at the 1st concave part (DP1) of the position of not coinciding with the 1st electrode (12) and cover the 1st insulating film (13) of the installation face (S1) of the 1st substrate (11), 2 electronic parts contains: the 2nd substrate (21) and formed at the 2nd electrode (22) of the installation face of the 2nd substrate (21), electric conductivity grafting material (31) to the 1st electrode (12) make the 1st electrode (12) and the 2nd electrode (22) electric conductance lead to with the state that the 2nd electrode (22) were faced, it is with insulating nature grafting material (32), sealed with the clearance of the 1st insulating film (13) with 2 electronic parts's installation face.