BONDED PART OF ELECTRONIC COMPONENTS, METHOD FOR CONNECTING ELECTRONIC COMPONENT USING BONDED PART AND METHOD FOR MANUFACTURING BONDING PART OF ELECTRONIC COMPONENTS

摘要

PROBLEM TO BE SOLVED: To obtain a bonded part of electronic components in which the connection terminals of an electronic component can be connected stably with small conductor resistance.;SOLUTION: The bonded part of electronic components comprises an insulating resin ball 60, and a conductor plug 70 of low temperature melting point metal formed in a through hole 62 through the center of the ball. Opposite ends of the conductor plug 70 project outward of the ball 60 through the opening end of the through hole 62. The bonded part is interposed between the connection terminals of the electronic components and then the conductor plug 70 and the ball 60 of the electronic components are heated to reflow thus connecting the terminals of the electronic components through the conductor plug 70. The electronic components in the vicinity of the connection terminal can be bonded with the insulating resin through reflow of the ball 60.;COPYRIGHT: (C)2001,JPO