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Highly reliable lead-free solder alloy for electronic applications in harsh environments
Highly reliable lead-free solder alloy for electronic applications in harsh environments
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机译:适用于恶劣环境下的电子应用的高度可靠的无铅焊料合金
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摘要
A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt. % of Bi and/or 0.1-4.5 wt. % of In may be included in the solder alloy.
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