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Radio frequency (RF) sputter deposition source, deposition apparatus and method of assembling same

机译:射频(RF)溅射沉积源,沉积设备及其组装方法

摘要

PROBLEM TO BE SOLVED: To provide a sputter deposition source for sputter deposition in a vacuum chamber, capable of providing improvement in stability of deposition conditions, more excellent in layer quality, reduction or prevention in target damage and/or reduction or prevention in arc generation.SOLUTION: A sputter deposition source 100 for sputter deposition comprises: the wall part 102 of a vacuum chamber; a target 20 supplying a material to be deposited during sputter deposition; an RF power supply for supplying RF electric power to the target; an electric power connector 124 for connecting the target to the RF power supply; and a conductor rod 110 extended through the wall part on the outer side of the vacuum chamber from the inner side of the vacuum chamber. The conductor rod 110 is connected to one or more components on the inner side of the vacuum chamber and is connected to the RF power supply on the outer side of the vacuum chamber, and a determined RF return path passing through the conductor rod 110 is formed.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种用于在真空室中进行溅射沉积的溅射沉积源,其能够改善沉积条件的稳定性,更优异的层质量,减少或防止靶损伤和/或减少或防止电弧的产生。解决方案:用于溅射沉积的溅射沉积源100包括:真空室的壁部102;靶20,其在溅射沉积期间提供要沉积的材料;射频电源,用于向目标提供射频功率;电源连接器124,用于将目标连接至RF电源;导体棒110从真空室的内侧延伸穿过真空室的外侧的壁部。导体杆110连接到真空室的内侧上的一个或多个部件,并且连接到真空室的外侧上的RF电源,并且形成穿过导体杆110的确定的RF返回路径。 .SELECTED DRAWING:图1

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