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BRIGHT NICKEL PLATING METHOD AND CONTROL METHOD OF BRIGHT NICKEL PLATING FILM

机译:亮镍镀膜的控制方法及控制方法

摘要

To provide a bright nickel plating method in which a bright nickel plating film, which has an excellent high corrosion resistance and an excellent high hardness property, can be formed suppressing a nickel elution.SOLUTION: A bright nickel plating method is a method in which a to-be-plated object is contacted to a bright nickel plating solution including a water soluble nickel compound, a primary brightener, a secondary brightener, and a potential conditioner. In the bright nickel plating method, (1) the content of the primary brightener in the bright nickel plating solution is 0.1-2.0 g/L, (2) the content of the secondary brightener in the bright nickel plating solution is 0.01-0.5 g/L; and (3) the content of the potential conditioner in the bright nickel plating solution is 0.25-5.0 g/L.SELECTED DRAWING: None
机译:提供一种光亮镍电镀方法,其中可以形成具有优异的高耐蚀性和优异的高硬度性能的光亮镍电镀膜,从而抑制镍的溶出。使待镀物体与包括水溶性镍化合物,一次增白剂,二次增白剂和电位调节剂的光亮镍镀液接触。在光亮镍电镀方法中,(1)光亮镍电镀液中一次增白剂的含量为0.1-2.0 g / L,(2)光亮镍电镀液中二次增白剂的含量为0.01-0.5 g / L; (3)光亮镍镀液中电位调节剂的含量为0.25-5.0 g / L。

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