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Bright nickel plating method and control method of bright nickel plating film.
Bright nickel plating method and control method of bright nickel plating film.
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机译:光亮镍镀方法和光亮镍镀膜的控制方法。
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摘要
To provide a bright nickel plating method capable of forming a bright nickel plating film excellent in high corrosion resistance and high hardness and in which the elution of nickel is suppressed. The present invention relates to a bright nickel plating method in which an object to be plated is brought into contact with a bright nickel plating solution containing a water-soluble nickel compound, a primary brightener, a secondary brightener, and a potential regulator. The content of the primary brightener in the bright nickel plating solution is 0.1 to 2.0 g / L, and (2) the content of the secondary brightener in the bright nickel plating solution is 0.01 It is -0.5 g / L and (3) Content of the said potential regulator in the said bright nickel plating solution is 0.25-5.0 g / L, The bright nickel plating method characterized by the above-mentioned. 【Selection chart】 None
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机译:本发明提供一种光亮镍镀敷方法,其能够形成高耐蚀性,高硬度且抑制镍的溶出性优异的光亮镍镀膜。本发明涉及一种光亮镍电镀方法,其中,使待镀物体与包含水溶性镍化合物,一次增白剂,二次增白剂和电势调节剂的光亮镍电镀液接触。光亮镍电镀液中一次增白剂的含量为0.1至2.0 g / L,(2)光亮镍电镀液中二次增白剂的含量为0.01至-0.5 g / L和(3)含量2.一种光亮镍电镀方法,其特征在于,所述光亮镍电镀液中的所述电位调节剂的含量为0.25〜5.0g / L。 【选型表】无
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