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Method of and system for performing defect detection on or characterization of a layer of a semiconductor element or semi-manufactured semiconductor element
Method of and system for performing defect detection on or characterization of a layer of a semiconductor element or semi-manufactured semiconductor element
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机译:用于在半导体元件或半成品半导体元件的层上执行缺陷检测或表征的方法和系统
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摘要
The present document relates to a method of performing defect detection on a self-assembled monolayer of a semiconductor element or semi-manufactured semiconductor element, using an atomic force microscopy system. The system comprises a probe with a probe tip, and is configured for positioning the probe tip relative to the element for enabling contact between the probe tip and a surface of the element. The system comprises a sensor providing an output signal indicative of a position of the probe tip. The method comprises: scanning the surface with the probe tip; applying an acoustic vibration signal to the element; obtaining the output signal indicative of the position of the probe tip; monitoring probe tip motion during said scanning for mapping the surface of the semiconductor element, and using a fraction of the output signal for mapping contact stiffness indicative of a binding strength.
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