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Flip-chip SMT LEDs with variable number of emitting surfaces

机译:发光表面数量可变的倒装芯片SMT LED

摘要

A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an optically reflective layer over the LEDs, and singulating the LEDs into LED units. The method may further include, after forming the optically transparent spacer layer and before singulating the LEDs, forming a secondary light-emitting layer that conforms to the LEDs, cutting the LEDs to form LED groups having a same arrangement, spacing the LED groups on a support, and forming the optically reflective layer in spaces between the LED groups.
机译:制造发光二极管(LED)单元的方法包括:将LED布置成图案;在LED上方形成光学透明的间隔层;在LED上方形成光学反射层;以及将LED分割成LED单元。该方法可以进一步包括,在形成光学透明的间隔层之后并且在将LED单个化之前,形成与LED相符的次级发光层,切割LED以形成具有相同布置的LED组,在LED上间隔开LED组。支撑,并在LED组之间的空间中形成光学反射层。

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