首页> 外国专利> Flip-chip SMT LEDs with a variable number of light emitting surfaces

Flip-chip SMT LEDs with a variable number of light emitting surfaces

机译:具有可变数量的发光表面的倒装芯片SMT LED

摘要

A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an optically reflective layer over the LEDs, and singulating the LEDs into LED units. The method may further include, after forming the optically transparent spacer layer and before singulating the LEDs, forming a secondary light-emitting layer that conforms to the LEDs, cutting the LEDs to form LED groups having a same arrangement, spacing the LED groups on a support, and forming the optically reflective layer in spaces between the LED groups.
机译:一种使发光二极管(LED)单元的方法包括在图案中布置LED,在LED上形成光学透明间隔层,在LED上形成光学反射层,并将LED分成LED单元。该方法可以进一步包括在形成光学透明间隔层之前和在单一单一地单张LED之前形成符合LED的二次发光层,切割LED以形成具有相同布置的LED组,在A上间隔LED组。支持,并在LED基团之间的空间中形成光学反射层。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号