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Stretchable circuit board and stretchable circuit board manufacturing method

机译:可拉伸电路板及可拉伸电路板的制造方法

摘要

Provided is a stretchable circuit board including: a stretchable base material having stretchability; a film base material overlapping with part of a one-surface-side surface of the stretchable base material and having lower stretchability than that of the stretchable base material; a stretchable wiring line formed on the one-surface-side surface of the stretchable base material; and an adhesive layer formed on one surface side or the other surface side of the stretchable base material. The adhesive layer is formed on both of an overlapping region where the stretchable base material overlaps with the film base material and a non-overlapping region where the stretchable base material does not overlap with the film base material.
机译:本发明提供一种伸缩性电路板,其包括:具有伸缩性的伸缩性基材;和膜基材,其与可拉伸基材的一个表面侧表面的一部分重叠,并且具有比可拉伸基材的拉伸性低的拉伸性。伸缩性配线形成在伸缩性基材的一面侧的面上。粘合剂层形成在可拉伸基材的一个表面侧或另一表面侧。粘合层形成在可拉伸基材与膜基材重叠的重叠区域和可拉伸基材与膜基材不重叠的非重叠区域两者上。

著录项

  • 公开/公告号US10595402B2

    专利类型

  • 公开/公告日2020-03-17

    原文格式PDF

  • 申请/专利权人 NIPPON MEKTRON LTD.;

    申请/专利号US201816188513

  • 发明设计人 MASAYUKI IWASE;

    申请日2018-11-13

  • 分类号H05K1;H05K1/02;H05K1/03;H05K1/11;H05K1/18;H05K3;H05K3/06;H05K3/20;H05K3/28;H05K3/36;H05K3/40;H05K3/46;H05K1/14;H05K1/09;

  • 国家 US

  • 入库时间 2022-08-21 11:30:17

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