首页> 外文期刊>MRS bulletin >Printed circuit board technology inspired stretchable circuits
【24h】

Printed circuit board technology inspired stretchable circuits

机译:印刷电路板技术启发了可拉伸电路

获取原文
获取原文并翻译 | 示例
       

摘要

In the past 15 years, stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections, and sensor circuit technologies. In the meantime, a wide variety of processes using many different materials have been explored in this new field. In the current contribution, we present an approach inspired by conventional rigid and flexible printed circuit board (PCB) technology. Similar to PCBs, standard packaged, rigid components are assembled on copper contact pads using lead-free solder reflow processes. Stretchability is obtained by shaping the copper tracks as horseshoe-shaped meanders. Elastic materials, predominantly polydimethylsiloxanes, are used to embed the conductors and the components, thus serving as a circuit carrier. We describe mechanical modeling, aimed at optimizing the build-up toward maximum mechanical reliability of the structures. Details on the production process, reliability assessment, and a number of functional demonstrators are described.
机译:在过去的15年中,可伸缩电子电路已成为装配,互连和传感器电路技术领域中的一种新技术。同时,在这个新领域中,已经探索了使用许多不同材料的多种工艺。在当前的贡献中,我们提出了一种受传统刚性和柔性印刷电路板(PCB)技术启发的方法。与PCB相似,标准封装的刚性组件使用无铅焊料回流工艺组装在铜接触垫上。通过将铜轨成形为马蹄形的曲折而获得可拉伸性。弹性材料(主要是聚二甲基硅氧烷)用于嵌入导体和组件,从而用作电路载体。我们描述了机械建模,旨在优化结构以实现结构的最大机械可靠性。描述了生产过程,可靠性评估和许多功能演示器的详细信息。

著录项

  • 来源
    《MRS bulletin》 |2012年第3期|p.254-260|共7页
  • 作者单位

    Centre lor Microsystems Technology, Ghent University and Interuniversity Microelectronics Centre, Ghent, Belgium;

    Interuniversity Microelectronics Centre, Leuven, Belgium;

    Centre for Microsystems Technology, Ghent University and Interuniversity Microelectronics Centre, Ghent, Belgium;

    MC10 Inc., Cambridge, MA 02140, USA;

    Centre for Microsystems Technology, Ghent University and Interuniversity Microelectronics Centre, Ghent, Belgium;

    Interuniversity Microelectronics Centre and Katholieke Universiteit Leuven, Belgium;

    Centre for Microsystems Technology, Ghent University and Interuniversity Microelectronics Centre, Ghent, Belgium;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号