首页> 外国专利> Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate

Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate

机译:磷化铟基板,磷化铟基板的检查方法以及磷化铟基板的制造方法

摘要

An indium phosphide substrate, a method of inspecting thereof and a method of producing thereof are provided, by which an epitaxial film grown on the substrate is rendered excellently uniform, thereby allowing improvement in PL characteristics and electrical characteristics of an epitaxial wafer formed using this epitaxial film. The indium phosphide substrate has a first main surface and a second main surface, a surface roughness Ra1 at a center position on the first main surface, and surface roughnesses Ra2, Ra3, Ra4, and Ra5 at four positions arranged equidistantly along an outer edge of the first main surface and located at a distance of 5 mm inwardly from the outer edge. An average value m1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.5 nm or less, and a standard deviation σ1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.2 nm or less.
机译:提供一种磷化铟衬底,其检查方法及其制造方法,通过该磷化铟衬底,使在衬底上生长的外延膜具有极好的均匀性,从而可以改善使用该外延膜形成的外延晶片的PL特性和电特性。电影。磷化铟衬底具有第一主表面和第二主表面,在第一主表面上的中心位置处的表面粗糙度Ra 1 和表面粗糙度Ra 2 。 Ra 3 ,Ra 4 和Ra 5 在沿着第一主表面的外边缘等距排列的四个位置处从外边缘向内5毫米。表面粗糙度Ra 1 ,Ra 2 ,Ra 3 ,Ra 的平均值m 1 4 和Ra 5 为0.5 nm或更小,并且表面粗糙度Ra 1 的标准偏差σ 1 ,Ra 2 ,Ra 3 ,Ra 4 和Ra 5 为0.2nm以下。

著录项

  • 公开/公告号US10473445B2

    专利类型

  • 公开/公告日2019-11-12

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC INDUSTRIES LTD.;

    申请/专利号US201515541754

  • 发明设计人 SHINYA FUJIWARA;YASUAKI HIGUCHI;

    申请日2015-12-07

  • 分类号G01B5/28;H01L29/34;B24B37/08;B24B37/10;C30B33;G01Q60/24;H01L21/02;H01L29/20;B24B57/02;C30B25/20;C30B29/40;H01L33;C30B11;

  • 国家 US

  • 入库时间 2022-08-21 11:30:08

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号