Image sensing chip package and image sensing chip packaging method
展开▼
机译:影像感测芯片封装及影像感测芯片封装方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
An image sensing chip package and an image sensing chip packaging method are provided. In the image sensing chip package, an image sensing chip is located in a through hole of a substrate, and a front surface of the image sensing chip is flush with a first surface of the substrate. In this way, in the image sensing chip package, a height of the image sensing chip is controlled with the first surface of the substrate as a reference. Since the first surface of the substrate does not change in the packaging process, almost no uncontrollable factor affects the height of the image sensing chip.
展开▼