首页> 外国专利> METHOD FOR SETTING A PRESSURE IN A CAVERN FORMED WITH THE AID OF A SUBSTRATE AND OF A SUBSTRATE CAP, SEMICONDUCTOR SYSTEM, IN PARTICULAR, WAFER SYSTEM

METHOD FOR SETTING A PRESSURE IN A CAVERN FORMED WITH THE AID OF A SUBSTRATE AND OF A SUBSTRATE CAP, SEMICONDUCTOR SYSTEM, IN PARTICULAR, WAFER SYSTEM

机译:在基质和基质盖的辅助下,在空腔中设置压力的方法,半导体系统,特别是晶片系统

摘要

A method for setting a pressure in a cavern formed using a substrate and a substrate cap, the cavern being part of a semiconductor system, including an additional cavern formed with using the substrate and of the substrate cap, a microelectromechanical system being situated in the cavern, an additional microelectromechanical system being situated in the additional cavern, a diffusion area being situated in the substrate and/or in the substrate cap, the method includes a gas diffusing with the aid of the diffusion area from the surroundings into the cavern, during the diffusing, a diffusivity and/or a diffusion flow of the gas from the surroundings into the cavern being greater than an additional diffusivity and/or an additional diffusion flow of the gas from the surroundings into the additional cavern, and/or during the diffusing, the additional cavern being at least essentially protected from a penetration of the gas into the additional cavern.
机译:一种在由衬底和衬底盖形成的洞穴中设定压力的方法,该洞穴是半导体系统的一部分,包括由使用衬底和衬底盖形成的附加洞穴,微机电系统位于该洞穴中,另外的微机电系统位于另外的洞穴中,扩散区域位于衬底和/或衬底盖中,该方法包括在扩散期间气体从周围环境扩散到洞穴中的气体。扩散时,气体从周围环境进入洞穴的扩散率和/或扩散流大于气体从周围环境到另外洞穴的扩散率和/或气体的扩散流,和/或在扩散过程中,至少从本质上保护附加洞穴,以防止气体渗透到附加洞穴中。

著录项

  • 公开/公告号US2020180947A1

    专利类型

  • 公开/公告日2020-06-11

    原文格式PDF

  • 申请/专利权人 ROBERT BOSCH GMBH;

    申请/专利号US201916700391

  • 发明设计人 JOHANNES CLASSEN;

    申请日2019-12-02

  • 分类号B81C1;B81B7/04;

  • 国家 US

  • 入库时间 2022-08-21 11:28:22

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