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Method for forming semiconductor package structure with twinned copper layer
Method for forming semiconductor package structure with twinned copper layer
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机译:具有双晶铜层的半导体封装结构的形成方法
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摘要
A semiconductor package structure is provided. The semiconductor package structure includes a chip structure. The semiconductor package structure includes a first conductive structure over the chip structure. The first conductive structure is electrically connected to the chip structure. The first conductive structure includes a first transition layer over the chip structure, and a first conductive layer on the first transition layer. The first conductive layer is substantially made of twinned copper.
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