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High-chi block copolymers with tunable glass transition temperatures for directed self-assembly

机译:具有可调玻璃化温度的高智嵌段共聚物,用于定向自组装

摘要

Directed self-assembly (DSA) using block copolymers (BCPs) is emerging as a viable alternative to photolithography for creating features 10 nm and smaller. Block copolymers with balanced surface energy between the polymer blocks, tunable χ, and tunable glass transition temperatures (Tg) have been formulated. The block copolymers can achieve perpendicular orientation by simple thermal annealing due to the surface energy balance between the polymer blocks, which allows avoiding solvent annealing or top-coat. The χ value can be tuned up to achieve L0 as low as 12 nm for lamellar-structured BCPs and hole/pillar size as small as 6 nm for cylinder-structured BCPs. The Tg of the BCPs can also be tuned to lower than those of PS-b-PMMA standards. The enhanced polymer chain mobility resulting from the decreased Tg of the block copolymer may help with improving the kinetics of BCP self-assembly during the thermal annealing.
机译:使用嵌段共聚物(BCP)的直接自组装(DSA)逐渐成为光刻技术的可行替代方案,以创建10 nm或更小的特征。制备了在聚合物嵌段之间具有平衡的表面能,可调的χ和可调的玻璃化转变温度(T g )的嵌段共聚物。由于聚合物嵌段之间的表面能平衡,嵌段共聚物可通过简单的热退火获得垂直取向,从而避免了溶剂退火或面漆。可以调整χ值,以使L 0 对于层状结构的BCP达到低至12 nm,而孔/柱的尺寸对于圆柱结构的BCP可以达到6 nm。还可以将BCP的Tg调整为低于PS-b-PMMA标准的Tg。由嵌段共聚物的Tg降低引起的增强的聚合物链迁移性可以帮助改善热退火期间BCP自组装的动力学。

著录项

  • 公开/公告号US10734239B2

    专利类型

  • 公开/公告日2020-08-04

    原文格式PDF

  • 申请/专利权人 BREWER SCIENCE INC.;

    申请/专利号US201815909751

  • 发明设计人 KUI XU;

    申请日2018-03-01

  • 分类号H01L21/308;H01L21/311;H01L21/027;C08F12/08;C08F220/14;C08G81/02;H01L21/3213;C08F293;C08F2/38;

  • 国家 US

  • 入库时间 2022-08-21 11:26:51

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