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Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
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机译:具有引线键合和烧结区域的半导体器件及其制造工艺
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摘要
An electronic device includes: a semiconductor body; a front metallization region; a top buffer region, arranged between the front metallization region and the semiconductor body; and a conductive wire, electrically connected to the front metallization region. The top buffer region is at least partially sintered.
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